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POLYFUSE ? Resettable PTCs
Radial Leaded > 30R Series
Soldering Parameters - Wave Soldering
Refer to the condition recommended
by the ?ux manufacturer.
Pre-Heating Zone
Max. ramping rate should not exceed
260
Soldering
Cooling
4°C/Sec.
220
Soldering Zone
Max. solder temperature should not
exceed 260°C
190
Preheating
160
Cooling Zone
Cooling by natural convection in air.
0
60 min.
5 max.
Time(s)
Physical Speci?cations
Environmental Speci?cations
Lead Material
Soldering
Characteristics
Insulating Material
Device Labeling
0.90-2.50A: Tin-plated Copper clad steel
3.00-9.00A: Tin-plated Copper
Solderability per MIL–STD–202,
Method 208E
Cured, ?ame retardant epoxy polymer
meets UL94V-0 requirements.
Marked with ‘LF’, voltage, current rating,
and date code.
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped State
Passive Aging
Humidity Aging
-40°C to +85°C
125°C
+85°C, 1000 hours
-/+5% typical resistance
change
+85°C, 85% R.H., 1000 hours
-/+5% typical resistance
change
+85°C to -40°C 10 times
Thermal Shock
Solvent Resistance
Moisture Resistance Level
-/+5% typical resistance
change
MIL–STD–202, Method 215F
No change
Level 1, J–STD–020C
? 2010 Littelfuse, Inc
Speci?cations are subject to change without notice.
Please refer to www.littelfuse.com/series/30R.html for current information.
77
Revised: July 12, 2010
30R Series
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